Reverse Analysis of Surface Strain in Elasto-Plastic Materials by Nanoindentation

Author:

Long Xu1ORCID,Shen Ziyi1,Lu Changhen1,Jia Qipu1,Guan Cao1,Chen Chuantong2,Wang Haodong3,Li Ye3

Affiliation:

1. School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, P. R. China

2. Flexible 3D System Integration Laboratory, Osaka University, Osaka 567-0047, Japan

3. School of Civil and Environmental Engineering, Harbin Institute of Technology, Shenzhen 518055, P. R. China

Abstract

In this study, nanoindentation technology is utilized to investigate the in situ mechanical behavior of small-sized packaging materials. Rather than the ideal cases with unprestressed materials which have been intensively studies, this paper focuses on the effect of surface stress by prestressing the materials to be indented by a Berkovich indenter. The loading process until the maximum penetration depth is simulated by finite element (FE) models. With elastoplastic materials as described by a power-law model, extensive FE predictions are performed with the wide ranges of Young’s modulus, yield strength and hardening exponent with and without pre-strain. FE results show that with different prestress values, the applied load-penetration depth responses vary in a highly consistent manner. The residual indentation profiles are found to be closely related with the stress state due to the pre-strain values. On the basis of FE simulations, a dimensionless function is therefore derived and a reverse algorithm is proposed to estimate the constitutive parameters and also the surface stress of elastoplastic materials. With one of the most commercialized lead-free solder materials in electronic packaging structures, the proposed reverse algorithm is utilized to estimate the residual stress based on the nanoindentation response of solder samples with different annealing conditions.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shaanxi Province

Astronautics Supporting Technology Foundation of China

Fundamental Research Funds for Central Universities of the Central South University

Publisher

World Scientific Pub Co Pte Ltd

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3