A STUDY ON WETTABILITY AND DEFECTS BEHAVIOR OF FLOW-SOLDERED JOINT USING LOW RESIDUE FLUX-Reference-Cited by-同舟云学术

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A STUDY ON WETTABILITY AND DEFECTS BEHAVIOR OF FLOW-SOLDERED JOINT USING LOW RESIDUE FLUX

Published:1998-09 Issue:03n04 Volume:08 Page:235-241
ISSN:0960-3131
Container-title:Journal of Electronics Manufacturing
language:en
Short-container-title:Journal of Electronics Manufacturing

Author:

CHOI M. K.,LEE C. Y.,SHUR C. J.,JUNG J. P.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://www.worldscientific.com/doi/pdf/10.1142/S0960313198000227

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced Interfacial Joining and Electrical Contact Performance of Eco-friendly Ag/Ti3AlC2 with Cu-Zn Contact Bridge via Induction Welding;Journal of Materials Engineering and Performance;2024-08-16

2. Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging;Soldering & Surface Mount Technology;2022-02-15

3. Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids;Journal of Electronic Materials;2021-08-27

4. Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder;Journal of Electronic Materials;2019-01-08

5. Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag–Cu solders;Journal of the Taiwan Institute of Chemical Engineers;2011-03

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