CONTRIBUTION OF THE MORPHOLOGICAL GRAIN SIZES TO THE ELECTRICAL RESISTIVITY OF PLATINUM AND GOLD THIN FILMS-Reference-Cited by-同舟云学术

CONTRIBUTION OF THE MORPHOLOGICAL GRAIN SIZES TO THE ELECTRICAL RESISTIVITY OF PLATINUM AND GOLD THIN FILMS

Published:2004-08 Issue:04n05 Volume:11 Page:463-467
ISSN:0218-625X
Container-title:Surface Review and Letters
language:en
Short-container-title:Surf. Rev. Lett.

Author:

CATTANI M.¹,SALVADORI M. C.¹

Affiliation:

1. Instituto de Física, Universidade de São Paulo, C. P. 66318, CEP 05315-970, São Paulo, SP, Brazil

Abstract

We have measured the morphological grain sizes of nanostructured platinum and gold thin films. In previous works their electrical resistivities have been measured and a theoretical approach was proposed to explain the resistivity experimental data. It will be shown that within the framework of our theoretical approach, the morphological grain sizes play an essential role in the electrical resistivity of these metallic thin films.

Publisher

World Scientific Pub Co Pte Lt

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

https://www.worldscientific.com/doi/pdf/10.1142/S0218625X04006396

Reference12 articles.

1. Nanostructured materials: basic concepts and microstructure

2. Computer simulation of the structure and thermo-elastic properties of a model nanocrystalline material

3. MEASUREMENT OF CRITICAL EXPONENTS OF PLATINUM THIN FILMS

4. Measurement of the elastic modulus of nanostructured gold and platinum thin films

5. Nanostructured Gold Thin Films: Young Modulus Measurement

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