STUDY OF THE THERMAL STABILITY OF AN ORGANIC POLYMER LOW-K MATERIAL

Abstract

Polymer low-k materials have been regarded as one of the most promising candidates as interconnect insulator with copper metallization. One of the major problems associated with polymer materials is their poor thermal stability. In this paper, thermal stability of an aromatic hydrocarbon low-k material was studied using TGA, FTIR and thermal desorption-GC-MS techniques. The material is thermally stable at temperatures up to 430°C. At higher temperatures, thermal decomposition of the low-k material is pronounced and the major outgassing species are aromatic compounds and carbon dioxide.