Voxel-Based Solution Approaches to the Three-Dimensional Irregular Packing Problem

Author:

Lamas-Fernandez Carlos1ORCID,Bennell Julia A.2ORCID,Martinez-Sykora Antonio1ORCID

Affiliation:

1. Centre for Operational Research, Management Science and Information Systems (CORMSIS), Southampton Business School, University of Southampton, Southampton, SO17 1BJ, United Kingdom;

2. Centre for Decision Research, Leeds University Business School, University of Leeds, Leeds, LS2 9JT, United Kingdom

Abstract

Packing Three-Dimensional Irregular Objects Because of its many applications in practice, the cutting and packing literature is extensive and well established. It is mostly concerned with problems in one and two dimensions or with problems where some regularity of the pieces is assumed (e.g., packing boxes). However, the rise of applications in the realm of three-dimensional printing and additive manufacturing has created a demand for efficient packing of three-dimensional irregular objects. In “Voxel-Based Solution Approaches to the Three-Dimensional Irregular Packing Problem,” Lamas-Fernandez, Martinez-Sykora, and Bennell propose a series of tools to tackle this problem using voxels. These include geometric tools, a mathematical model, local search neighborhoods, and details on implementation of metaheuristic algorithms. These tools are tested extensively, and computational results provided show their effectiveness compared with state-of-the-art literature.

Publisher

Institute for Operations Research and the Management Sciences (INFORMS)

Subject

Management Science and Operations Research,Computer Science Applications

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Operational Research: methods and applications;Journal of the Operational Research Society;2023-12-27

2. Greedy Heuristic for Optimized Placement of Orthogonal Polyhedra in Irregular Cutting and Packing Problems;Advances in Mechanical Engineering;2023-12-19

3. Optimization of Packing Irregular Three-Dimensional Objects;Cybernetics and Computer Technologies;2023-12-04

4. SDF-Pack: Towards Compact Bin Packing with Signed-Distance-Field Minimization;2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS);2023-10-01

5. Dense, Interlocking-Free and Scalable Spectral Packing of Generic 3D Objects;ACM Transactions on Graphics;2023-07-26

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