Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)-Reference-Cited by-同舟云学术

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

Published:2014-11-10 Issue: Volume:12 Page:103-109
ISSN:1684-9973
Container-title:Advances in Radio Science
language:en
Short-container-title:Adv. Radio Sci.

Author:

Glocker E.,Boppu S.,Chen Q.,Schlichtmann U.,Teich J.,Schmitt-Landsiedel D.

Abstract

Abstract. This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

Publisher

Copernicus GmbH

Link

https://ars.copernicus.org/articles/12/103/2014/ars-12-103-2014.pdf

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