Numerical and experimental study of the contact resistance for high copper alloys in force domain 1–100 N

Author:

Benjemaa N.,El Abdi R.,Carvou E.

Publisher

EDP Sciences

Subject

Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference12 articles.

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2. J.L. Queffelec, N. Benjemaa, D. Travers, G. Pethieu,Materials and contact shape studies for automobile connector development, inProc. 36th IEEE Holm Conf. on Electrical Contacts, Montreal, Canada, 1990, pp. 225–231

3. A. Monnier, B. Froidurot, C. Jarrige, R. Meyer, P. Testé, inProc. 51st IEEE Holm Conf. on Electrical Contacts, Chicago, USA, 2005, pp. 224–231

4. R. Zauter, D.V. Dashov, inProc. Conf. ICEC, Sendai, Japan, 2006, pp. 257–261

5. Ansys website: http://www.ansys.com

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1. A Comprehensive Review of the Finite Element Modeling of Electrical Connectors Including Their Contacts;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05

2. Nanoporous Copper Pattern Fabricated by Electron Beam Irradiation on Cu 3 N Film for SERS Application;physica status solidi (b);2018-10

3. Modellbildung und Simulation bei elektrischen Kontakten;Elektrische Kontakte, Werkstoffe und Anwendungen;2016

4. The evolution of Cu3N films irradiated by femtosecond laser pulses;Applied Surface Science;2013-03

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