An Investigation of TiO2Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
Author:
Publisher
EDP Sciences
Subject
General Medicine
Link
http://www.matec-conferences.org/10.1051/matecconf/20167801070/pdf
Reference11 articles.
1. Satyanarayan K.N. Prabu, Adv. Colloid Interface Sci.,166(2011)
2. Li L., Yang R., Kai Lin J., Int. Sym. Adv. Pkg. Mat., 112 (2001)
3. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
4. Guo F.,Lead-free Electronic Solders(2006)
5. Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering;Encyclopedia of Materials: Electronics;2023
2. Microstructure evolution of Sn-Cu based solder paste on electroless nickel immersion gold (ENIG) surface finish subjected to multiple reflow cycles;PROCEEDINGS OF 8TH INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS ENGINEERING & TECHNOLOGY (ICAMET 2020);2021
3. Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition;IOP Conference Series: Materials Science and Engineering;2019-12-01
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