Microstructure and mechanical properties of pure copper subjected to skin pass asymmetric rolling

Abstract

Pure copper after 300°C annealing has been processed by skin pass asymmetric rolling up to small and medium total reductions in this work to study the evolution of microstructure, mechanical properties and texture. Subsequent EBSD characterization shows that after 300 °C annealing, the grains equiaxed but the texture is still typical rolling texture. At small rolling reductions (5.0% and 11.8%), the microstructure did not change much, the stress increased, and the ductility were still high (>20%), and the texture remained the same. At higher rolling reduction (32.0%), the grains were refined, the stress increased but the ductility decreased at the same time, and the texture remained the same. At medium rolling reduction (63.6%), the grains were further refined, the stress further increased, and the ductility further decreased, and the texture changed from typical rolling texture to shear texture at the edge and rolling texture at the centre.