Joining Photovoltaic Cell Connection Strips Using Ultra-Acoustic Wave - Resistive Hybrid Heating System

Author:

Țunescu Traian1,Filipciuc Andreea1,Ştefan Iulian1,Sîrbu Nicușor-Alin2,Savu Ionel Dănuț1ORCID,David Andrej3,Savu Sorin Vasile1,Olei Adrian Bebe1

Affiliation:

1. University of Craiova

2. ISIM Timisoara

3. University of Žilina in Žilina

Abstract

The manufacture of photovoltaic panels for the production of sustainable energy also involves the stage of electrical connection of the cells in the panel structure. This electrical connection is made by soldering of copper strips on the negative electrode of the cell. During the bonding process, due to the temperature of approximately 220-240°C at which the connecting strip is continuously heated, cracking processes of the upper layer of glass from the cell surface were identified. For this reason, it is necessary either to heat to lower temperatures, a solution that is not viable due to the melting temperature of the solder alloy which usually exceeds 210°C, or a different dosing of the heat flux. The solution proposed in the paper is to create a variable heat flux that allows the melting of the solder alloy, but at the same time to reduce the thermal load of the glass support layer. Through the proposed variant, the energy dosing is done with the help of a heating system consisting of two sources, an ultra-acoustic energy source and a classical resistive source. The resistive source provides an amount of energy to ensure a temperature in the range of 60-140°C, the difference to the melting point of the solder alloy being transferred locally by ultrasonic pulses. Research has highlighted the need to limit the range of values of the pressure of the circular sonotrode, which positively influences the mechanical stress of the photovoltaic cell, but also leads to a reduction in the joining speed. The dosing of the two components of the total energy, the one coming from the resistive source and the one coming from the ultra-acoustic vibration source is decisive for the efficiency of the joining process and for the quality of the soldered joint. Microscopic analyses revealed micro-cracks of the glass surface layer at forces higher than 100 N. Areas with lack of soldering for resistive heating at temperatures lower than 130oC were highlighted, the difference of 90-110°C being achieved by the contribution of ultra-acoustic energy.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference13 articles.

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2. M. Heimann et. al., Investigations of different soldering failure modes and their impact on module reliability, Energy Procedia 55 (2014) 456 – 463.

3. A. De Rose, et. al., Interconnection of silicon heterojunction solar cells by infrared soldering – solder joint analysis and temperature study, 36th European PV Solar Energy Conference and Exhibition, 09-13 September, 2019, Marseille.

4. F. Kiefer et. al., Influence of solder pads to PERC solar cells for module integration, Energy Procedia 38 (2013) 368 – 374.

5. S. Gallardo-Saavedra, L. Hernandez-Callejo, O. Duque-Perez, Analysis and characterization of PV module defects by thermographic inspection, Revista Facultad de Ingeniería, Universidad de Antioquia, No.93, pp.92-104, Oct-Dec (2019).

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