Investigations of Different Soldering Failure Modes and their Impact on Module Reliability-Reference-Cited by-同舟云学术

Investigations of Different Soldering Failure Modes and their Impact on Module Reliability

Published:2014 Issue: Volume:55 Page:456-463
ISSN:1876-6102
Container-title:Energy Procedia
language:en
Short-container-title:Energy Procedia

Author:

Heimann Matthias,Bakowskie Ronny,Köhler Matthias,Hirsch Jens,Junghänel Matthias,Hussack Alexander,Sachert Steffen

Publisher

Elsevier BV

Reference3 articles.

1. M. Heimann et al. “Ultrasonic Bonding of Aluminium Ribbons to Interconnect High-Efficiency Crystalline-Silicon Solar Cells” Energy Procedia Volume 27, 2012, Pages 670-675 Proceedings of the 2nd International Conference on Crystalline Silicon Photovoltaics SiliconPV 2012.

2. Influence of the rear side failure contact of crystalline silicon solar cells and their electrical properties on module level;Hirsch,2013

3. J. Wendt, M. Traeger, M. Mette, A. Pfennig and B. Jäckel “The Link between mechanical stress induced by soldering and micro damages in silicon solar cells”, Proc. of 24th EUPVSEC,Hamburg, Germany 2009.

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