Selectivity Tuning by Peroxide Concentration for the Selective Etching of SiGe20 to Si and SiGe40 to SiGe20

Author:

Lopez Villanueva Francisco Javier1,Sebaai Farid2,Altamirano-Sanchez Efrain2,Klipp Andreas1

Affiliation:

1. BASF SE

2. IMEC VZW

Abstract

Using two highly efficient inhibitors, one for silicon and one for SiO2 and SiN it is possible by varying the hydrogenperoxide concentration to achieve tuneable formulated chemistry concerning selectivity. So, the same formulation can be used for the selective etching of SiGe25 vs. Si like for GAA applications as well as for the selective etching of SiGe40 vs. SiGe20 like for CFET applications.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Reference8 articles.

1. Selective Wet Etching in Fabricating SiGe and Ge Nanowires for Gate-all-Around MOSFETs;Liu;Solid State Phenomena,2018

2. SiGe Selective Etchant for Gate-all-Around Transistors, Solid State Phenomena, 2021, Vol. 314, pp.71-76

3. A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options Done by Virtual Fabrication;Vincent;IEEE Journal of the Electron Devices Society

4. 'Nanosheet-based complementary field-effect transistors (CFETs) at 48nm gate pitch, and middle dielectric isolation to enable CFET inner spacer formation and multi-Vt patterning', H. Mertens et al., VLSI (2023)

5. 'Integration of a stacked contact MOL for monolithic CFET', V. Vega-Gonzalez et al., VLSI (2023)

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