Research on Warpage of Polystyrene in Selective Laser Sintering

Abstract

Warpage is a crucial factor to accuracy of sintering part in selective laser sintering (SLS) process. In this paper, The influence of process parameters on warpage when sintering polystyrene(PS) materials in SLS are investigated. The laser power, scanning speed, hatch spacing, layer thickness as well as temperature of powder are considered as the main process parameters. The results showed that warpage increases with the increase of hatch space. Contary to it, warpage decreases with the increase of laser power. Warpage decreases with the increase of layer thickness between 0.16~0.18mm and changes little with increase of the thickness. Warpage increases along with the increase of scanning speed but decreases when the speed is over about 2000mm/s. When the temperature changes between 82°C-86°C, warpage decreases little with the increase of temperature. But further increase of temperature leads to warpage decreasing sharply when the temperature changes between 86°C-90°C.