The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films-Reference-Cited by-同舟云学术

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The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

Published:2003-08 Issue: Volume:426-432 Page:3481-3486
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Joo Young Chang¹,Hwang Soo Jung¹,Park Hyun²

Affiliation:

1. Seoul National University

2. Seoul National University of Technology

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.426-432.3481.pdf

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Preparation Methods for Cu Foil on the Electric‐Explosion Properties;Propellants, Explosives, Pyrotechnics;2021-02-22

2. Surface Chemical Composition and Morphology;Handbook of Silicon Wafer Cleaning Technology;2008

3. Electromigration and Stress Voiding of Cu/low-k Semiconductor Interconnects—65 nm Interconnect Technology and Beyond;Journal of Nanoelectronics and Optoelectronics;2007-08-01

4. The mechanical properties of freestanding electroplated Cu thin films;Journal of Materials Research;2006-06-01

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