MD Simulation and Optimization Analysis for Nanoscale Material Removal Process

Abstract

To understand the thermal effects on material removal at atomic level, molecular dynamics (MD) simulation and optimization method are performed with the aid of Morse, EAM and Tersoff potential. The heat distribution is showed in 3D images under various parameters. The simulation results reveal that the heat distribution is roughly concentric around the tool edge and a steep temperature gradient is observed between diamond tool and chip. During material removal process, there is a narrow region with high temperature in shear zone where most of heat generated due to plastic deformation of workpiece material, the high temperature extends from here to chip, diamond tool and workpiece, but the highest temperature lies in chip. Compared with low speed, a higher temperature region below the tool edge implied a larger shear stress is built up in a local region and a rougher machined surface is generated at high cutting speed.