The Buckling Simulation of Planar W-Form Micro-Spring in MEMS Safety and Arming Device

Author:

Wang Fu Fu1,Lou Wen Zhong1,Liu Fang Yi1,Wang Da Kui1,Lu Jun2,Wu Jian2,Guo Xu Hong2,Zhang Zhe2

Affiliation:

1. Beijing Institute of Technology

2. China North Industries Group Corporation

Abstract

This paper describes the stability research of MEMS spring used in fuze. The micro-spring in thickness dimension is thin, while the size of axial direction is larger, during compression the micro-spring is prone to suffering buckling and become unstable. In order to consider the extreme environments in launch, this paper aims to carry out buckling simulation in high or low temperature, by using FEM analysis. The effect of temperature load on the micro-spring buckling can be obtained. These researches can provide theory reference for the design applications and reliability analysis of micro-spring, and also lay the foundation for the response characteristics of the micro-scale elastic components under compressive force.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference5 articles.

1. James L. Zunino III, Donald R. Skelton, Charles Robinson. Reliability testing & analysis of Safing & Arming devices for Army fuze [J]. Proc. of SPIE, 2008-144. 206. 159. 178.

2. Robinson C. H. Ultra-miniature, monolithic, mechanical safety-and- arming (S& A) device for projected munitions: USP, 6064013[P], (2001).

3. Shi Gengchen, Li Hua. MEMS springs of fuze [J]. Journal of Detection &Control, 2008, 30(2): 8-12.

4. Sui Li, Shi Gengchen. The assembly research of MEMS fuze mechanism [J]. Journal of Detection &Control, 2008, 30(3): 64-67.

5. Wang Zhen. Stability analysis and optimization of micro compressed spring [D]. Beijing: Beijing institute of technology, (2014).

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2. Microelectronic materials, microfabrication processes, micromechanical structural configuration based stiffness evaluation in MEMS: A review;Microelectronic Engineering;2022-07

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