Affiliation:
1. Xi’an Jiaotong University
Abstract
In this paper, ANSYS, a finite element analysis software is used to simulate the change of temperature field in micro-hole processing with millisecond laser, which determines the diameter and depth of the hole drilled. The relationship between processing parameters and the hole size is plotted, so as to achieve size control of a micro-hole processing. Compared with experimental results, simulation is effective for laser processing of micro-hole and can be referenced to choose the best processing parameters.
Publisher
Trans Tech Publications, Ltd.
Reference3 articles.
1. Yuhong Wang. numerical simulation technology research in process of micro-hole processing with laser[D]. Changchun: Changchun university of science and technology, (2008).
2. Linsen Song，Guoquan Shi, Zhanguo Li. ANSYS in application of simulation of laser drilling temperature field[J]. Journal of Changchun University of Science and Technology, Vol. 29(4) (2006), pp.19-21.
3. Xinglun Tang. ANSYS engineering application course (heat and electromagnetism article)[M]. Beijing: China railway publishing house, (2003).
Cited by
2 articles.
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