Affiliation:
1. University of Electronic Science and Technology of China
2. UESTC -PRECISION Limited Liability Company
Abstract
A transient thermal model for Micro USB V2.0 electronic connector was created based on 3D finite element method. Then get the laser soldering spots on the temperature and stress the distribution of simulation by ANSYS software. Temperature fields at different time, residual stress in different locations and deformations were analyzed. The result shown that the maximum deformation of metal-pin reached 1.4mm, achieved the process standard.
Publisher
Trans Tech Publications, Ltd.
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1 articles.
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