Effect of Processing Conditions on Bonding Strength at Al(Si)/Diamond Interfaces

Author:

Edtmaier Christian1,Segl Jakob1,Koos Robert2,Schöbel Michael2,Feldbaumer Christioph1

Affiliation:

1. Technical University Vienna

2. TU München

Abstract

Understanding thermos-physical properties of MMCs includes considering interfacial processes and interactions between the constituents in MMCs. In this context, interfacial bonding is of vital interest for a deeper understanding of composites. Neutron diffraction experiments on Al/diamond composites were performed and reconciled with their thermo-physical properties and quantification of interfacial carbides formation. To create different interfacial conditions both, the contact time during processing the MMCs by liquid metal infiltration and the nominal composition of the matrix were changed, thus creating different amounts of interfacial Al4C3 carbides. Neutron diffraction showed the increase in contact time and the addition of Si to Al both increase the bonding strength, although going with a significant decrease of the composite`s thermal conductivity.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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