Author:
Schöbel M.,Altendorfer W.,Degischer H.P.,Vaucher S.,Buslaps T.,Michiel M. Di,Hofmann M.
Subject
General Engineering,Ceramics and Composites
Reference17 articles.
1. Metal-matrix composites for electronic packaging;Zweben;J Metal,1992
2. ICCM12 proceedings;Lefranc,1999
3. Schmitt;Huber;Comput Sci Technol,2006
4. Thermal-expansion stresses in reinforced plastics
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