Thermal expansion studies on aluminium-matrix composites with different reinforcement architecture of SiC particles

Author:

Huber T.,Degischer H.P.,Lefranc G.,Schmitt T.

Publisher

Elsevier BV

Subject

General Engineering,Ceramics and Composites

Reference23 articles.

1. Metal-matrix composites for electronic packaging;Zweben;J Metal,1992

2. Kelly A, McCartney LN. Controlling thermal expansion by use of composite materials. In: ECCM-11, proceedings CD, Rhodes; 2004.

3. Lefranc G, Degischer HP, Sommer KH, Mitic G. Al–SiC improves reliability of IGBT power modules. In: Massard T, editor. ICCM12 proceedings, Paris, electronic support; 1999.

4. AlSiC composites as a base material for high power;Schmitt;PCIM Europe,2000

5. Clyne TW. In: Kelly A, Zweben C, editor (vol. editor, Clyne TW). Comprehensive composite materials, vol. 3, Metal matrix composites, Elsevier Science Ltd., Oxford; 2000.

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