Affiliation:
1. Linköping University
2. Norstel AB
3. Dow Corning Corporation
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
9 articles.
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1. Fundamental Aspects of SiC;Materials Science and Technology;2013-02-15
2. Electronic Configuration of Tungsten in 4H-, 6H-, and 15R-SiC;Materials Science Forum;2012-05
3. Defects in SiC;Defects in Microelectronic Materials and Devices;2008-11-19
4. Electronic Structure of Deep Defects in SiC;Silicon Carbide;2004
5. Deep levels in silicon carbide Schottky diodes;Applied Surface Science;2002-02