Affiliation:
1. Fraunhofer Einrichtung für Zuverlässigkeit und Mikrointegr.
2. Samsung Electronics Co. Ltd
Abstract
This document explains different approaches to integrating electronics in textiles. It
discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are
evaluated concerning their applicability in textile integrated electronics.
Furthermore a specific assembly with embroidered wiring and embroidered interconnections has
been developed and improved. Two different encapsulation technologies have been developed for
this assembly. Standardized tests have been carried out to assess the reliability of the assembly and
its encapsulations. Finally the achievements are critically discussed.
Publisher
Trans Tech Publications Ltd
Cited by
43 articles.
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