Effect of Environment on Sn Whisker Growth during Welding of Electronic Wires

Author:

Sakakida Tomomi1,Kubouchi Tatsuo2,Miyano Yasuyuki2,Takahashi Mamoru2,Kamiya Osamu2

Affiliation:

1. Nippon Chemi-Con Corporation

2. Akita University

Abstract

In Pb-free Al-Sn welding of electrolytic parts, single-crystal Sn whiskers easily form and can cause problems such as short circuits. Here we report that the growth of Sn whiskers in the weld zone of Al electrolytic condenser leads was suppressed in a vacuum environment. We examined the effect of the environment and weld metal microstructure in order to understand how to control and prevent whisker growth. In vacuum, the weld zone did not form whiskers after more than 100 h, whereas in air, whiskers grew within several hours. This suggests that whiskers require oxygen to form. The growth can be explained by the energy balance between the potential energy of the weld metal and the surface energy of the whisker. Our results will contribute to developing techniques for suppressing the formation of Sn whiskers during the percussion welding of Al electrolytic capacitor leads.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference7 articles.

1. NASA Tin Whisker (and Other Metal Whisker) Homepage http: /nepp. nasa. gov/whisker.

2. T. Kubouchi, O. Kamiya: Study of Sn Whisker Growth Mechanism in Welding Lead, Journal of Smart Processing for Materials, Environment & Energy, Vol. 2, No. 3(2013), 135-141.

3. O. Kamiya, S. Morikawa, and T. kubouchi: Sn-Whisker Formation in micro Bonding, ICMR Akita keynote Session, B1-4(2005).

4. T. Kubouchi, O. Kamiya: Microstructure of Bonding interface and Influence of Sn plate in Welding of Lead for Aluminum Electrolytic Condenser, International Journal of the Society of Materials Engineering for Resources, 23-1(2010), 13-18.

5. T. Kubouchi, O. Kamiya, T. Sakakida, M. Chiba and S. Nishikawa: Controlling technology of Sn whisker in welding of electronics lead, Journal of Achievements in Materials and Manufacturing Engineering, 35-2(2012), 727-733.

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