Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film

Author:

Wang Xing Fang1

Affiliation:

1. Changzhou Institute of Light Industry Technology

Abstract

The distributions of residual stresses for zinc-plated film were measured quantitatively by X-ray diffraction (XRD), its interfacial structures were observed with scanning electron microscope (SEM). The effects of residual stress on bonding strength of zinc-plated film were investigated, and its influence mechanism was discussed. The experimental results show that residual stresses of zinc-plated film are behaved as tensile stress, which increase with its thickness, bonding strength of zinc-plated film is inverse ratio with residual stresses; the effects of residual stress on film crack are obvious, tensile stress speeds film cracking, which decrease its bonding strength; bonding strength of zinc-plated film is increased by improving its residual stress distribution.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

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