Development of Rotary Work Table with Constant-Flow Hydrostatic Water Bearing for Large Scale Silicon-Wafer Grinding Machine-Reference-Cited by-同舟云学术

Development of Rotary Work Table with Constant-Flow Hydrostatic Water Bearing for Large Scale Silicon-Wafer Grinding Machine

Published:2014-09 Issue: Volume:1017 Page:604-609
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Okahata Go¹,Yui Akinori¹,Kitajima Takayuki¹,Okuyama Shigeki¹,Saito Hirotsugu²,Slocum Alexander Henry³

Affiliation:

1. National Defense Academy

2. Okamoto Machine Tool Works LTD

3. Massachusetts Institute of Technology

Abstract

There is a compelling need for development of a surface grinding machine for 450mm diameter silicon-wafers. The authors have developed a new surface grinding machine for the large scale silicon-wafers. The machine has a rotary work table equipped with a constant-flow hydrostatic water bearing. The table system has to attain high static stiffness to achieve higher loop stiffness. This paper investigates static performances of the rotary table by numerical computation. The obtained results are compared with the experimental ones. Accordingly, it is verified that the developed rotary table has sufficient static performances for the large scale silicon-wafer grinding machine.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.1017.604.pdf

Reference4 articles.

1. X. Lu, M. Paone, I. Usman, A. H. Slocum, A. Yui, ROTARY-AXIAL SPINDLES FOR PRECISION MANUFACTURING, Proc. of ASPE 2008 Annual Conference, (2008) 17-20.

2. G. Rothenhöfer, A. H. Slocum, T. Kitajima, An adjustable kinematic coupling for use in machine tools with a tight structural loop, Precision Engineering, 37 (2013) 61-72.

3. G. Okahata, S. Okuyama and A. Yui, Numerical Study on Constant-Flow Hydrostatic Water Bearing for a Machine-tool Table, Advanced Materials Research, 325 (2011) 357-362.

4. A. Yui, A. Honda, S. Okuyama, T. Kitajima, G. Okahata, H. Saito and A. H. Slocum, Development of a vertical-spindle rotary surface grinding machine for large scale silicon-wafers –Machine specifications and performance of rotary work table–, Proc. of 13th euspen International Conference, 1(2013).

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1. Process study on large-size silicon wafer grinding by using a small-diameter wheel;Journal of Advanced Mechanical Design, Systems, and Manufacturing;2015

2. Development of Rotary Work Table with Constant-Flow Hydrostatic Water Bearing for Large Scale Silicon-Wafer Grinding Machine;Advanced Materials Research;2014-09