Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method-Reference-Cited by-同舟云学术

Study on the Joint Strength of SiCp/ Al Metal Matrix Composite by Magnetron Sputtering Method

Published:2009-08 Issue: Volume:628-629 Page:569-574
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Chen Rong Fa¹,Zhao Yi Hong²,Shen Zhao Xia²,Dai Liang Gang²,Zhang Xian Liang²,Zhu Rui²

Affiliation:

1. Yang Zhou University

2. Yangzhou University

Abstract

Transient liquid-phase (TLP) bonding of aluminium-based metal matrix composite (MMC) has been investigated. An attempt was made of using an Ag/Cu /Ag film as an interlayer for bonding to improve the joint strength. The oxide on the surface of SiCp/Al MMC was etched completely by plasma. Ag/Cu/Ag film of 8µm thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber. Compared with the same thickness of single Cu foil and Ni foil interlayer, which are widely used for joining SiCp/Al MMC material, the shear strength of 192.8MPa was obtained, which was 86.5% that of base metal. Discussion was made on the bonding process and microstructure.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.628-629.569.pdf

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