On the Formation of Ni-Based Ohmic Contacts to n-Type 4H-SiC

Author:

Kuchuk Andrian V.1,Kladko V.P.1,Piotrowska Anna2,Ratajczak Renata3,Jakieła Rafał4

Affiliation:

1. V. Lashkaryov Institute of Semiconductor

2. Institute of Electron Technology

3. The Andrzej Soltan Institute for Nuclear Studies

4. Polish Academy of Sciences

Abstract

In this study, the formation of Ni, Ni-rich Ni2Si and Si-rich NiSi2 ohmic contacts to n-type 4H-SiC are investigated. The Ni/n-SiC ohmic contact with resistance rc ~ 4.2×10-4 Ω cm2 is formed after annealing at 1050oC. For Ni2Si/n-SiC, the contact resistances were rc ~ 4×10-4 Ωcm2 and rc ~ 3.5×10-4 Ωcm2 after annealing at 1000 and 1050oC, respectively. The non-ohmic I-V characteristics are observed for NiSi2/n-SiC contact even after annealing at 1050oC. The features of ohmic contact formation for Ni-based metallization to 4H n-SiC are discussed.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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