Affiliation:
1. Cree Incorporation
2. Cree, Incorporation
3. Cree, Inc.
4. U.S. Naval Research Laboratory
Abstract
This paper presents the effect of recombination-induced stacking faults on the drift based
forward conduction and leakage currents of high voltage 4H-SiC power devices. To show the effects,
IV characteristics of a 4H-SiC 10 kV DMOSFET and a 4H-SiC 4 kV BJT have been evaluated before
and after the induction of stacking faults in the drift epilayer. For both devices, significant increases in
forward voltage drops, as well as marked increases in leakage currents have been observed. The
results suggest that injection of minority carriers in majority carrier devices should be avoided at all
times.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献