High-Performance Multi-Wafer SiC Epitaxy – First Results of Using a 10x100mm Reactor

Author:

Hecht Christian1,Stein René A.2,Thomas Bernd2,Wehrhahn-Kilian Larissa2,Rosberg Jonas3,Kitahata Hiroya3,Wischmeyer Frank3

Affiliation:

1. SiCED Electronics Development

2. Infineon Technologies AG

3. AIXTRON AG

Abstract

In this paper, we present first results of epitaxial layer deposition using a novel warm-wall CVD multi-wafer system AIX 2800G4 WW from AIXTRON with a capability of processing 10x100mm wafers per run. Intra-wafer and wafer-to-wafer homogeneities of doping and thickness for full-loaded 10x100mm runs will be shown and compared to results of the 6x100mm setup of our hot-wall reactor VP2000HW by AIXTRON used for device production since 2001.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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