The Soaking Process Optimization for the Conductive Slip-Ring

Abstract

Due to its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology was put forward for which includes a soaking process.By the construction of the soaking models, the packaging technology was calculated by MATLAB and discussed. The soaking model reveals that the soaking time is strongly influenced by the space of the exhaust vent and the added pressure. When the soaking pressure is set at 6 atm with the vent of 0.02 mm width, the EMC can be completely soaked into the tiny spaces of the CSR in 5 min.