Modeling and Simulation of Electrical Activation of Acceptor-Type Dopants in Silicon Carbide

Author:

Šimonka Vito1,Hössinger Andreas2,Weinbub Josef3,Selberherr Siegfried1

Affiliation:

1. TU Wien

2. Silvaco Europe Ltd.

3. Christian Doppler Laboratory for High Performance TCAD, Institute for Microelectronics, TU Wien

Abstract

We propose an empirical model to predict electrical activation ratios of aluminium- and boron-implanted silicon carbide with respect to various annealing temperatures. The obtained parameters and model extensions are implemented into Silvaco’s Victory Process simulator to enable accurate predictions of post-implantation process steps. The thus augmented simulator is used for numerous simulations to evaluate the activation behavior of p-type dopants as well as for the full process simulation of a pn-junction SiC diode to extract the carrier and acceptor depth profiles and compare the results with experimental findings.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Comprehensive design solutions for wide bandgap power electronics;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

2. Simulation of the Effects of Postimplantation Annealing on Silicon Carbide DMOSFET Characteristics;IEEE Transactions on Electron Devices;2019-07

3. Transient model for electrical activation of aluminium and phosphorus-implanted silicon carbide;Journal of Applied Physics;2018-06-21

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