Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range-Reference-Cited by-同舟云学术

Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range

Published:2012-05 Issue: Volume:717-720 Page:853-856
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Tanimoto Satoshi¹,Matsui Kohei¹,Zushi Yusuke¹,Sato Shinji¹,Murakami Yoshinori¹,Takamori Masato²,Iseki Takashi²

Affiliation:

1. Furure Power Electronics Technology (FUPET), Nissan Motor Co. Ltd.

2. Sumitomo Metal Mining Co., Ltd

Abstract

A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using eutectic Zn-Al solder (m.p. = 356°C), focusing on preparation and die-shear reliability. Superior wettability and reproducibility were achieved in the soldering process. It was found that the attachments were viable at least for short-term application in a temperature range up to 300°C. Reliability test results revealed that they could withstand storage for 1500 hours at 200°C and thermal cycle stress of 1500 cycles between –40°C and 200°C.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.717-720.853.pdf

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