High-Temperature Performance of 1200 V, 200 A 4H-SiC Power DMOSFETs

Author:

Cheng Lin1,Ryu Sei Hyung2,Agarwal Anant K.3,O'Loughlin Michael J.1,Burk Albert A.1,Richmond Jim1,Lelis Aivars J.4,Scozzie Charles4,Palmour John W.1

Affiliation:

1. Cree, Incorporation

2. Cree Incorporation

3. Cree, Inc.

4. U.S. Army Research Laboratory

Abstract

We have investigated the thermal behavior of our recently developed 1200 V, 200 A 4H-SiC power DMOSFETs operating from 20°C up to 300°C. Compared to the first generation SiC DMOSFET that was commercially released early this year, this 4H-SiC power DMOSFET shows a ~ 50% reduction in the total specific on-resistance at room temperature. Temperature dependence of the key parameters of this MOSFET, such as on-resistance, threshold voltage, and the MOS channel mobility, are reported in this paper. The MOSFET showed normally-off characteristics throughout the entire experimental temperature range. Different temperature dependence of the total on-resistance in different temperature regimes has been observed.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference5 articles.

1. http: /www. cree. com/press/press_detail. asp?i=1295272745318.

2. B. A. Hull et al., Materials Science Forums Vols. 615-617 (2009), pp.749-752.

3. S. -H. Ryu, L. Cheng, S. Dhar, C. Capell, C. Jonas, A. Agarwal, J. Palmour, A. Lelis, C. Scozzie, and B. Geil, 23rd International Symposium on Power Semiconductor Devices & IC's, 2011 (ISPSD'11), San diego, CA, USA, May 22 – 27, (2011).

4. S. -H. Ryu, L. Cheng, S. Dhar, C. Capell, C. Jonas, R. Callanan, M. O'Loughlin, A. Burk, A. Lelis, C. Scozzie, A. Agarwal, and J. Palmour, to be presented at ICSCRM 2011, Cleveland, Ohio, USA, Sept. 11-16, (2011).

5. L. Cheng, A. K. Agarwal, S. Dhar, S. -H. Ryu, B. A. Hull, and J. W. Palmour, presented at 2011 Electronic Materials Conference (EMC), Santa Barbara, CA, USA, Jun. 22-24, (2011).

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