Analysis of Contaminated Oxide-Silicon Interfaces

Author:

Polignano Maria Luisa1,Codegoni Davide2,Castellano Luca2,Greco Stefano2,Borionetti Gabriella3,Bonoli Francesco3,Nutsch Andreas4,Altmann Roswitha4,Liebold Andreas4,Otto Michael4,Monge Paolo5,Riva Caterina5

Affiliation:

1. Micron Italy

2. Micron

3. MEMC Electronic Materials

4. Fraunhofer IISB

5. ST Microelectronics

Abstract

Methods for the analysis of the oxide-silicon interface were compared for their ability to reveal metal segregation at the interface and organic contamination. The impact of these contaminations on surface recombination velocity measurements, on capacitance vs. voltage, conductance vs. voltage and capacitance vs. time measurements and on MOS-DLTS spectra was studied. Niobium-contaminated wafers were used as an example of metal surface segregation, because it was previously shown that niobium is prone to surface segregation. Interface state density measurements obtained by the conductance method showed a limited impact of niobium implantation. Vice versa significant effects were found in MOS-DLTS spectra. For what concerns organic contamination, MOS-DLTS showed the most significant effects from the point-of-view of the intrinsic properties of the silicon oxide - silicon interface, and GOI tests demonstrate a clear impact of the organic contamination on MOS capacitors oxide breakdown events.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

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