Comparisons of Various Physical Cleaning

Author:

Bae Sang Won1,Kang Dae Hyuk1,Lee Hyo San1,Lee Kun Tack2,Koh Yong Sun1

Affiliation:

1. Samsung Electronics Co., Ltd.

2. Samsung Electronics Co. Ltd.

Abstract

Physical cleaning uses the physical force for particle removing process and the physical force can be represented by PRE(%) and pattern damage. Using the damage proving pattern, which was composed with conductive material for electrical detection, the damage of physical cleaning was quantitatively analyzed. And pattern damage was calculated with a form of damage density and plotted with pattern CD. Using PRE(%) and three parameters, which were derived in the damage density plot, the comparison of various physical cleaning was performed..

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

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