Affiliation:
1. Xidian University
2. China Electronics Technology Group Corporation No.54 Research Institute
Abstract
With the electronic toward miniaturization and multifunctional development, such as System-in-Package (SIP), Package-on-Package (POP), these packages have been widely used. Signal speeds increase and then require that signal has a good transmission quality. Therefore the design of signal integrity should take into account these issues from the beginning design. In this paper, a model about the wire bonding transmission problem between the upper and lower levels of chip is proposed. The simulation results are shown at the different height and radius of the equivalent model. Meanwhile, researching in different cases, noise interference source makes the influence on signal quality. Finally, by adding the signal return path, signal integrity is achieved well by the eye diagram analysis.
Publisher
Trans Tech Publications, Ltd.
Reference6 articles.
1. Shuhua Liu, Liqiang Cao, Jun Li, etal: 11th International Conference on Electronic Packaging Technology& High Density, Xi'an, China (2010), p.559.
2. Peter Rickert and William Krenik: IEEE Design & Test of Computer, Vol. 23(3) (2006), p.188.
3. A. Titus, B. Jaiswal, and T. Dishongh: IEEE trans. Adv. Package., Vol. 27(4) (2004), p.630.
4. Paolo Pulici, Gian Pietro Vanalli, Michele A. Dellutri, et al: Proceedings of the IEEE, Vol. 97(1) (2009), p.85.
5. Ying Liang, Chunyue Huang, Wanggang Wang: 11th International Conference on Electronic Packaging Technology& High Density, Xi'an, China (2010), p.811.