Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

Author:

Lee Sang Joo1,Han Seung Woo1,Kim Jae Hyun1,Lee Hak Joo1

Affiliation:

1. Korea Institute of Machinery and Materials

Abstract

It is quite difficult to accurately measure the mechanical properties of thin films. Currently, there are several methods (or application) available for measuring mechanical properties of thin films. Their properties, however, have been determined by indirect methods such as cantilever beam test and diaphragm bulge test. This paper reports the efforts to develop a direct strain measurement system for micro/nano scale thin film materials. The proposed solution is the Visual Image Tracing (VIT) strain measurement system coupled with a micro tensile testing unit, which consists of a piezoelectric actuator, load cell, microscope and CCD cameras. The advantage of this system is the ability to monitor the real time images of specimen during the test in order to determine its Young’s modulus and Poisson’s ratio at the same time. Stress-strain curve, Young’s modulus, yield strength and Poisson’s ratio of copper thin film measured using VIT system are presented.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Reference6 articles.

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3. W. C. Oliver and G. M. Pharr, an improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, Vol. 7 (1992), pp.1564-1583.

4. W. N. Sharpe Jr., K. T. Turner, R. L. Edwards, Tensile testing of polysilicon, Experimental Mechanics, Vol. 39 (1999), pp.161-169.

5. Y. A. Jeon, K. S. No, J. S. Kim and Y. S. Kim: Met. Mater. Int. Vol. 9 (2003), p.383.

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