Affiliation:
1. Korea Institute of Machinery and Materials
Abstract
A good designed MEMS microphone is very important for attaining good characteristics of sensitivity and frequency bandwidth with flat response. So we performed multi-physics finite element analysis that can predict an electro-mechanical behavior of MEMS microphone. Then we fabricated the well-designed MEMS microphone with using micromachining technique. The fabricated MEMS microphone was consisted with low stress poly-silicon membrane and electroplated back-plate. The simulation of sensitivity and frequency response of packaged MEMS microphone was carried out. The simulation results show the acoustic sensitivity of -40.91 dB and the cutoff frequency of 79.4 kHz, respectively.
Publisher
Trans Tech Publications, Ltd.
Reference7 articles.
1. P. R. Scheeper, A. G. H. Van der Donk, W. Olthuis and P. Bergveld, A review of silicon microphones, Sensors and Actuators A 44 (1994) 1-11.
2. W. Kühnel and G. Hess, A silicon condenser microphone with structured back plate and silicon nitride membrane, Sensors and Actuators A 30 (1992) 251–258.
3. A. Zuckerwar, Theoretical response of condenser microphones, J. Acoust. Soc. Am. 64 (1978) 1278-1285.
4. J. Park, H. Choi, Y. H. Lee and S. H, Designing a MEMS microphone using lumped element model and finite element method, Spring Conf. on Korean Soc. Mech. Eng. Micro/Nano (2010) 109-110.
5. C. W. Tan and J. Miao, Design optimization of condenser microphone: A design of experiment perspective, J. Acoust. Soc. Am. 125 (2009) 3641-3649.
Cited by
2 articles.
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