Empirical Process Model for Arsenic Diffusion in Si1-x-yGexCy Alloys

Author:

Sharma Abhishek A.1,Telang Santosh V.1,Shrivastav Ashish S.1,Shetty Saikalash D.1,Shetty Shweta U.1

Affiliation:

1. Sardar Patel Institute of Technology

Abstract

The thermal diffusion behavior of ion-implanted Arsenic (As) in SiGeC alloy has been investigated and modeled. This paper introduces an empirical model consisting of physics-based and process-based parameters for evaluating the effective diffusivity of Arsenic in SiGeC accurately. The different process parameters that were found to affect the diffusivity were – Germanium content (x), diffusion temperature (T) and Carbon content (y). Germanium content taken into account was 7% and 12.3% for compressive strain in the structure with a Carbon content of 0.2%. The model incorporates all the effects associated with the change in the process parameters which affect the diffusivity of As in compressively strained-Si1-x-yGexCy. The model was found to be extremely accurate in predicting the exact dependencies of As diffusivity on physics-based and process parameters. The proposed empirical process model may find suitable application in the prediction of thermal diffusion behavior of As in Si1-x-yGexCyprocess-flow as well as in improving the existing model in Silvaco’s TCAD suite.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference13 articles.

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2. Chia-Lin Chang, PhD thesis, Department of Electrical Engineering, Princeton University, Properties and Applications of Crystalline Si1-x-yGexCyalloys, pp.16-25, pp.60-67.

3. Properties Of Silicon Germanium and SiGe: C, Erich Kasper and Klara Lyutovich, University of Stuttgart, Germany.

4. G. A. Armstrong, C. K. Maiti, TCAD for Si, SiGe and GaAs integrated circuits, Institution of Engineering and Technology, London, United Kingdom, 2007, pp.70-74.

5. Eguchi, S.; Hoyt, J. L.; Leitz, C. W.; Fitzgerald, E. A.; , Comparison of arsenic and phosphorus diffusion behavior in silicon–germanium alloys, Applied Physics Letters , vol. 80, no. 10, pp.1743-1745, Mar (2002).

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