Design on UHV System with TSP

Author:

Zheng Jin Hua1,Li Cong Hui1,Zhang Chong1,Chao Yun Feng1

Affiliation:

1. Zhengzhou University

Abstract

A UHV(ultra-high vacuum) system, which used as deposition equipment with the assistance of high and low vacuum measuring instruments and other accessories, was designed in this paper. A CMP (composite molecular pump) in parallel with TSP (titanium sublimation pump) as the main pump and a rotary-vane pump as the backing pump were designed in this system. After a CMP with displacement 2300l/s was chosen as the one of the main pumps, the total flow conductance between the outlet of vacuum chamber and the CMP was 1344l/s. The rough pump-down time was approximate 5 min by using a rotary-vane pump with pumping speeds 15l/s. In order to ensure the normal operation of the main pumps, a water chilling unit was designed in the system, which can achieve limiting vacuum of 5×10-6Pa in the vacuum chamber of 0.2 m3.

Publisher

Trans Tech Publications, Ltd.

Reference4 articles.

1. C. Zhang, J. Zheng, C. Li, Y. Chao, Design on High Vacuum System with Molecular Pump, Applied Mechanics and Materials. 220-223 (2012) 459-462.

2. D. Da, Vacuum Design Manual, National Defence Industry Press, Beijing (1991).

3. C. Pan, Vacuum System Design of Planting Equipment, Progress Report on China Nuclear Science & Technology. 1(2009) 142-148.

4. J. Zheng, Y. Chen, A Study on Interface Strength of a-Si: H-DLC Film, Advanced Materials Research. 179-180(2011) 775-780.

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