Research Development of AuSn20 Solder Preparation Technology

Author:

Hu Jie Qiong1,Xie Ming1,Zhang Ji Ming1,Liu Man Men1,Chen Yong Tai1,Yang You Cai1

Affiliation:

1. Kunming Institute of Precious Metals

Abstract

With the development of miniaturization and lead free of electronic products, high demand is put forward about solder. AuSn20 lead free solder is widely used in high reliable hermetic package and die welding due to excellent mechanical property. This paper described the proper ties and preparation technology of AuSn20 solder, pointed out the disadvantages of the conventional drawing and rolling process, casting process and laminose composite process of cold rolling, put out improvement of study method and the preparation technology, investigate and develop the new forming technology for preparing AuSn20 low temperature eutectic solder, will achieve the solid basis for the large-scale production of this material.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference23 articles.

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3. Tummala R R. Microelectronics packing manual. Beijing: Electronic Industry Press, (2001).

4. Yu Z G. Low melting point Au-Sn solders. Nonferrous metals and application of rare earth, 1996, (2): 31-32.

5. Luo Y B, Xie H C, Li M. Present research situation of Au-Sn alloy solder. Nonferrous Metals, 2002, 54(s1): 23-26.

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