Subject
Cell Biology,Structural Biology,General Physics and Astronomy,General Materials Science
Reference10 articles.
1. A new bonding technique for microwave devices;Dohle;IEEE Trans. Comp. Packaging Manufact. Technol. B,1996
2. Low cost packaging of semiconductor laser arrays using passive self-aligned flip-chip techniques on Si motherboards;Hunziker,1996
3. Rapid solidification of metals and alloys;Jones;Institute of Metallurgists Monograph, No. 8,1982
4. AuSn/W and AuSn/Cr metallized chemical vapour deposited diamond heat sinks for InP laser device application;Katz;J. Appl. Phys.,1994
5. Advanced metallization schemes for bonding of InP-based laser devices to CVD-diamond heatsinks;Katz;Mater. Chem. Phys.,1994
Cited by
60 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献