Kinematic Analysis and Simulation of MID Laser Direct Structuring Equipment

Author:

Wu Yan Jun1,Zhuo Yong1,Peng Juan1,Wu Xuan1,Zhao Xin1

Affiliation:

1. Xiamen University

Abstract

Molded Interconnect Devices (MID) is an innovative technology in the field of mechatronics which abandons the conventional circuit boards and integrates the mechanical and electronic functions directly on the 3D injection molded thermoplastics. The Laser Direct Structuring (LDS) is the most efficient and advanced technology for the manufacrure of MID. In this paper, LDS technology and equipment have been introduced. Then through kinematic modeling analysis of the LDS equipment, getting the forward and inverse solution of laser focus position in the 3D space. And the LDS equipment processing path has been planned based on the kinematic analysis. Finally the simulation system of LDS has been developed based on Open CASCADE in order to inprove the processing efficiency and quality of MID.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Reference9 articles.

1. K. Feldmann, M. Pfeffer, A. Reinhardt: Creative Developments and innovative Technologies for the Further Success of MID, Proceedings of the 7th International Congress on Molded Interconnect Devices, (Fuerth, Germany, 2006), pp.1-15.

2. Yong Zhuo, Yanjun Wu, Juan Peng: Design and Simulation of 3D Layout for MID Based On Open CASCADE, Advanced Materials Research, Vol. 479-481 (2012), p.1978-(1981).

3. Information on http: /www. lpkf. cn/products/mid/index. htm.

4. Zhuang Liu, Guicheng Luo: Kinematic analysis and simulation of laser remote welding workstation, Laser Journal, Vol. 30. No. 3 (2009), pp.50-51.

5. Shichu Wang: Research on Path Planning for Remote Laser Welding System [D], Nanjing: Nanjing University of Aeronautics and Astronautics, (2007).

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