Abstract
Molded Interconnect Devices (MID) is an innovative technology which abandoned the conventional board and integrates the mechanical and electronic functions directly on materials. Due to the complex process, the existing MCAD and ECAD do not meet the requirements of MID, so an MID prototype system for design and simulation of 3D layout based on Open CASCADE has been developed in this paper. Through studying on the algorithm of 3D automatic routing, realized the functions of placement of 3D electronic components and 3D automatic routing. Also, simulation for 3D laser direct structuring and placement of electronic components with a six-axis robot has come true after studying manufacturing process of MID.
Publisher
Trans Tech Publications, Ltd.
Reference9 articles.
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