Affiliation:
1. IMEC VZW
2. Imec
3. Dublin Institute of Technology
4. IMEC Interuniversity Microelectronics Center
Abstract
In back-end of line (BEOL), the fluorinated polymer deposited on dielectric sidewalls during patterning [1,2] must be removed prior to subsequent processing steps to achieve good adhesion and coverage of materials (metals) deposited in the etched features. However, it is known that this type of fluorocarbon polymer is chemically inert to many existing wet clean solutions, including aqueous solutions such as fluoride ion-containing or highly alkaline solutions, and solvent mixtures. Exposure of the polymer to UV irradiation of selective wavelengths and doses significantly modifies the polymer film, which results in substantial removal ability in a subsequent wet clean process [2-3].
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Reference8 articles.
1. Y. Furukawa et al., Microelectron. Eng., 70, 267 (2003).
2. Q. T. Le et al, J. Electrochem. Soc. 159, H208 (2012).
3. Q. T. Le et al., ECS J. Solid State Sci. Technol. 2, N93 (2013).
4. Kesters et al., abstract submitted to UCPSS (2014).
5. T. Mukherjee et al., ECS Solid-St. Lett., 2, N11-N14 (2013).
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