Affiliation:
1. Universiti Malaysia Perlis (UniMAP)
Abstract
This research examines the influences of minor addition of Zn on the thermal and mechanical properties in Sn-0.7Cu solder alloy. The addition of 0.5, 1.0 and 1.5 wt.% of Zn were added into Sn-0.7Cu by using conventional casting method. It show that minor Zn addition has refined and promoted the nucleation of β-Sn phase. The vickers hardness show a increases the hardness of Sn-0.7Cu solder alloy with increasing amount of Zn. For thermal properties, with a small addition of Zn, it did not change the melting but has a slight decrease the undercooling of Sn-0.7Cu solder alloy.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
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