Affiliation:
1. SCREEN Semiconductor Solutions Co., Ltd.
Abstract
We investigated an alternative technology to conventional organic material removal that replaces sulfuric acid and hydrogen peroxide (SPM). We assumed that the removal model of organic material by ozone gas was absorption of oxygen radicals, generated by thermal decomposition of ozone, on a surface and subsequent reaction with organic materials. Then we characterized the correlation between removal rate and process parameter, and the validity of the model was verified. It also showed that this method is effective for high dose, ion-implanted photoresists.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献