Affiliation:
1. Mizoram University
2. National Institute of Technology
Abstract
In this paper the interface trap densities (Dit) are analyzed for ultra thin dielectric material based metal oxide semiconductor (MOS) devices using high-k dielectric material Al2O3. The Dit have been calculated by a novel approach using conductance method and it indicates that by reducing the thickness of the oxide, the Dit increases and similar increase is also found by replacing SiO2 with Al2O3. For the same oxide thickness SiO2 has the lowest Dit and found to be the order of 1011 cm-2eV-1. The Dit is found to be in good agreement with published fabrication results at p-type doping level of 1 × 1017 cm-3. Numerical calculations and solutions are performed by MATLAB and device simulation is done by ATLAS.
Publisher
Trans Tech Publications, Ltd.
Cited by
9 articles.
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