Affiliation:
1. Sungkyunkwan University
Abstract
The experimental investigation and non-linear finite element analysis using elastic-viscoplastic constitutive model were conducted to study the effect of ball shear speed on shear force of BGA solder joints. The Ag3Sn intermetallic compound (IMC) particles were found inside the Sn-3.5Ag solder, while the fine intermixed structure of lead-rich phases and tin-rich phases was investigated inside the eutectic Sn-37Pb solder. The shear force linearly increased with shear speed and reached to the maximum value at the highest shear speed in both experimental and computational results. All of the test specimens were fractured like ductile mode, and the plastic strain energy density distributions were deeply related to the failure mechanism.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference4 articles.
1. Ken Gilleo: Area Array Packaging Handbook (McGraw-Hill, New York 2002).
2. S.W. Ricky Lee, Xingjia Huang: Soldering & Surface Mount Technology Vol. 14 (2002), p.45.
3. JESD 22-B117, JEDEC Solid State Technology Association (2000).
4. L. Anand: J. Plasticity Vol. 1 (1985), p.213.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献